Samsung Expects HBM3E Integration In NVIDIA’s AI Accelerators By Next Quarter, Refuting Rumors of “HBM Business” Fall-Out

Samsung Expects HBM3E Integration In NVIDIA’s AI Accelerators By Next Quarter, Refuting Rumors of “HBM Business” Fall-Out

Samsung’s ambitions of supplying HBM products to NVIDIA aren’t over yet, as the firm announced that their 5th-gen HBM3E memory is slated to be used in NVIDIA’s flagship AI accelerators. Samsung’s Hopes For HBM Adoption Are… Article Source https://wccftech.com/samsung-expects-hbm3e-integration-in-nvidia-ai-accelerators-next-quarter/

NVIDIA Blackwell Ultra AI GPUs To Be Called B300, Feature 12-Hi HBM3E & TSMC CoWoS-L Tech

NVIDIA Blackwell Ultra AI GPUs To Be Called B300, Feature 12-Hi HBM3E & TSMC CoWoS-L Tech

NVIDIA’s next-gen Blackwell Ultra GPUs for AI computing are going to use the B300 branding, & feature upgraded HBM3e specs. NVIDIA To Debut The B300 “Blackwell Ultra” AI Series, An Upgraded Package With Heightened HBM3e… Article Source https://wccftech.com/nvidia-blackwell-ultra-ai-gpus-b300-feature-12-hi-hbm3e-tsmc-cowos-l/

Nvidia will be thrilled – Samsung’s archrival announces it has begun production of HBM3E that will be used in Blackwell Ultra GPUs

Nvidia will be thrilled – Samsung’s archrival announces it has begun production of HBM3E that will be used in Blackwell Ultra GPUs

South Korean memory giant SK Hynix has announced it has begun the mass production of the world’s first 12-layer HBM3E, featuring a total memory capacity of 36GB, a huge increase from the previous 24GB capacity in the 8-layer configuration. This… Article Source https://www.techradar.com/pro/nvidia-will-be-thrilled-samsungs-archrival-has-announced-it-has-begun-production-of-hbm3e-that-will-be-used-in-blackwell-ultra-gpus

Samsung’s HBM3E Memory Fails NVIDIA Qualification Test Citing Heat and Power Problems

Samsung’s HBM3E Memory Fails NVIDIA Qualification Test Citing Heat and Power Problems

Samsung’s HBM3E memory has reportedly failed NVIDIA’s qualification tests, bringing about challenges for the Korean company. The main reasons for the qualification failure are power consumption and heat issues, leading NVIDIA to prefer SK Hynix as a supplier over Samsung. Recent reports have surfaced highlighting shortcomings in Samsung’s HBM processes, with unofficial sources and Reuters … Read more

Korean Chipmaker Faces Challenges as Samsung HBM3E Chips Fall Short of Nvidia’s Heat and Power Specifications

Korean Chipmaker Faces Challenges as Samsung HBM3E Chips Fall Short of Nvidia’s Heat and Power Specifications

Samsung is facing challenges with its latest HBM3 and HBM3E memory stacks as they failed Nvidia’s tests due to excessive heat and power consumption issues, according to Reuters. This is significant as Nvidia dominates the global market for processors for artificial intelligence applications and relies on HBM supplies for its processors based on the Hopper … Read more