Competition between Japan and South Korea intensifies as they rush to develop GCS for next-gen chip packaging while Intel advances

Competition between Japan and South Korea intensifies as they rush to develop GCS for next-gen chip packaging while Intel advances

Glass core substrates (GCS) are expected to be essential in the advanced packaging of upcoming chip technologies. Companies in the semiconductor supply chain in Japan and South Korea are increasing their focus on developing GCS solutions or acquiring relevant companies to stay competitive in the market. Semiconductor players in both Japan and South Korea are … Read more