Synopsys Expedites Chip Innovation with Fully-Prepared Multi-Die Reference Flow for Intel Foundry

Synopsys Expedites Chip Innovation with Fully-Prepared Multi-Die Reference Flow for Intel Foundry

Synopsys has announced the availability of its multi-die reference flow for Intel Foundry’s EMIB packaging technology. This flow, powered by Synopsys.ai EDA Package and Synopsys IP, enables a unified co-design and analysis solution for multi-die designs. The 3DIC compiler from Synopsys supports efficient inter-die connectivity and high memory bandwidth requirements. This collaboration aims to accelerate … Read more