Synopsys Introduces Intel Foundry EMIB Reference Flow for Multi-die Systems – Embedded Applications
Synopsys has introduced a new reference flow in collaboration with Intel Foundry called the EMIB (Embedded Multi-die Interconnect Bridge) for…
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Synopsys has introduced a new reference flow in collaboration with Intel Foundry called the EMIB (Embedded Multi-die Interconnect Bridge) for…
Intel Foundry has recently announced partnerships with Cadence Design Systems, Ansys, and Synopsys to collaborate on advanced chip design and…
Synopsys has announced the availability of its multi-die reference flow for Intel Foundry’s EMIB packaging technology. This flow, powered by…
Intel has announced an expanded process roadmap and its ambition to become the No. 2 foundry by 2030. The company…
Intel (NASDAQ: INTC) is aiming to regain manufacturing dominance with a plan to launch five new process nodes in four…
Intel Corp. executives are facing a lawsuit filed by shareholders who claim they misled investors about the success of the…
Intel Foundry has made progress with the announcement of Intel Process 3. This new technology promises to advance the capabilities…
Intel is aiming to regain its manufacturing dominance by launching five new process nodes in four years. This includes Intel…
Intel has introduced its latest process node, Intel 3, which is expected to bring significant improvements and cater to foundry…
In recent news, TDK has developed a solid-state battery with a high energy density of 1,000 Wh/liter, suitable as a…