Report: NVIDIA Could Transition to Enhanced FOPLP Packaging for A.I. Chips by 2025
In a recent report from Taiwan, it was revealed that NVIDIA is taking steps to optimize the supply chain for their latest AI chips. The report suggests that NVIDIA’s Blackwell GPUs, known for their high performance in AI applications, may start using panel-level fan-out packaging for their GB200 GPU earlier than anticipated in 2025. The … Read more