Korean Chipmaker Faces Challenges as Samsung HBM3E Chips Fall Short of Nvidia’s Heat and Power Specifications
Samsung is facing challenges with its latest HBM3 and HBM3E memory stacks as they failed Nvidia’s tests due to excessive heat and power consumption issues, according to Reuters. This is significant as Nvidia dominates the global market for processors for artificial intelligence applications and relies on HBM supplies for its processors based on the Hopper … Read more