EDA tools enablement enhances Intel’s EMIB packaging technology – EDN
Intel is enhancing its Embedded Multi-Die Interconnect Bridge (EMIB) packaging technology by partnering with EDA tools. This collaboration aims to…
Tag: EMIB
The industry-standard design and test tools now support Intel’s EMIB packaging tech
Intel’s EMIB packaging technology is being increasingly adopted by Intel Foundry customers, with support from third-party EDA tools. Companies like…
Intel Foundry ecosystem partners incorporate reference flows for advanced packaging technology EMIB
Intel’s foundry ecosystem partners have recently introduced reference flows for advanced EMIB (Embedded Multi-die Interconnect Bridge) packaging. This technology allows…
Synopsys Introduces Intel Foundry EMIB Reference Flow for Multi-die Systems – Embedded Applications
Synopsys has introduced a new reference flow in collaboration with Intel Foundry called the EMIB (Embedded Multi-die Interconnect Bridge) for…
Siemens Achieves Certification on Intel Nodes and Introduces EMIB Embedded Technology
Siemens has recently achieved certification for Intel nodes and has added EMIB technology to its lineup. This marks a significant…
New Integration of Intel EMIB Interconnect in EDA Vendor Design Flows for 3D ICs Announced
Several EDA vendors have announced the integration of Intel’s EMIB interconnect technology into their design processes for 3D integrated circuits.…
Cadence enhances support for Intel 18A and EMIB in embedded systems
Cadence, a leading technology company, has announced that they will be adding support for Intel’s 18A and EMIB technologies. This…