Intel is enhancing its Embedded Multi-Die Interconnect Bridge (EMIB) packaging technology by partnering with EDA tools. This collaboration aims to provide a more efficient and reliable solution for integrating multiple types of chips into a single package. The EMIB technology allows for the stacking of multiple chips in a single package, enabling better performance and … Read more
Intel’s EMIB packaging technology is being increasingly adopted by Intel Foundry customers, with support from third-party EDA tools. Companies like Ansys, Cadence, Siemens, and Synopsys now offer software that supports EMIB chiplet-to-chiplet interconnects for AI and HPC processors. EMIB technology allows for the integration of multi-chip designs into a single package using a silicon bridge … Read more
Intel’s foundry ecosystem partners have recently introduced reference flows for advanced EMIB (Embedded Multi-die Interconnect Bridge) packaging. This technology allows for the integration of multiple chips on a single package, enabling enhanced performance and power efficiency in electronic devices. EMIB packaging is a key innovation in the semiconductor industry as it enables different types of … Read more
Synopsys has introduced a new reference flow in collaboration with Intel Foundry called the EMIB (Embedded Multi-die Interconnect Bridge) for multi-die integration. This technology allows for the seamless integration of multiple chips on a single package, enabling more efficient and powerful semiconductor designs. The EMIB reference flow from Synopsys and Intel Foundry aims to streamline … Read more
Siemens has recently achieved certification for Intel nodes and has added EMIB technology to its lineup. This marks a significant milestone for the company as it looks to expand its capabilities in the field of semiconductor technology. The certification on Intel nodes will allow Siemens to further enhance its product offerings and provide customers with … Read more
Several EDA vendors have announced the integration of Intel’s EMIB interconnect technology into their design processes for 3D integrated circuits. This new development will allow for the creation of more complex and advanced ICs, improving the overall performance and efficiency of electronic devices. EDA vendors play a crucial role in the design and development of … Read more
Cadence, a leading technology company, has announced that they will be adding support for Intel’s 18A and EMIB technologies. This development was made known by Cadence today. They are incorporating these advancements into their offerings to better serve their clients and keep up with the fast-paced technology industry. Intel’s 18A technology is known for its … Read more