EDN

EDA tools enablement enhances Intel’s EMIB packaging technology – EDN

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Intel is enhancing its Embedded Multi-Die Interconnect Bridge (EMIB) packaging technology by partnering with EDA tools. This collaboration aims to provide a more efficient and reliable solution for integrating multiple types of chips into a single package. The EMIB technology allows for the stacking of multiple chips in a single package, enabling better performance and … Read more

Intel reveals new high-speed optical I/O chiplet technology – EDN

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Intel has recently announced the launch of a new high-speed optical I/O chiplet, which aims to improve data transfer speeds in electronic devices. The chiplet is designed to facilitate faster and more efficient communication between different components, ultimately enhancing the overall performance of these devices. The chiplet utilizes optical technology to transmit data at high … Read more