EDA tools enablement enhances Intel’s EMIB packaging technology – EDN
Intel is enhancing its Embedded Multi-Die Interconnect Bridge (EMIB) packaging technology by partnering with EDA tools. This collaboration aims to…
Tag: EDN
Intel reveals new high-speed optical I/O chiplet technology – EDN
Intel has recently announced the launch of a new high-speed optical I/O chiplet, which aims to improve data transfer speeds…