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EDA tools enablement enhances Intel’s EMIB packaging technology – EDN

Intel is enhancing its Embedded Multi-Die Interconnect Bridge (EMIB) packaging technology by partnering with EDA tools. This collaboration aims to provide a more...

Intel reveals new high-speed optical I/O chiplet technology – EDN

Intel has recently announced the launch of a new high-speed optical I/O chiplet, which aims to improve data transfer speeds in electronic devices....

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