Intel is enhancing its Embedded Multi-Die Interconnect Bridge (EMIB) packaging technology by partnering with EDA tools. This collaboration aims to provide a more efficient and reliable solution for integrating multiple types of chips into a single package. The EMIB technology allows for the stacking of multiple chips in a single package, enabling better performance and … Read more
Major electronic design automation (EDA) vendors have announced their plans to support Intel’s new foundry business as the chipmaker seeks to expand its presence in the semiconductor industry. The move is part of Intel’s efforts to break into the competitive foundry market and compete with established players like TSMC and Samsung. Intel recently revealed its … Read more
Siemens Digital Industries Software and Intel Foundry have officially certified Solido EDA software for utilization in Intel nodes 16 and 18A. This certification enables the implementation of an integrated multi-die interconnect bridge (EMIB), which can greatly enhance the performance, space efficiency, and energy efficiency of 3D-IC designs for customers in a more expedited manner. Intel … Read more
Several EDA vendors have announced the integration of Intel’s EMIB interconnect technology into their design processes for 3D integrated circuits. This new development will allow for the creation of more complex and advanced ICs, improving the overall performance and efficiency of electronic devices. EDA vendors play a crucial role in the design and development of … Read more