Synopsys has introduced a reference flow that offers a holistic co-design and analysis solution using their 3DIC compiler to aid in the development of multi-die designs. This solution is designed to speed up the process of exploring and creating multi-die designs from silicon to system stages. By integrating 3DSO.ai with the 3DIC compiler, Synopsys aims to optimize signal, power, and thermal integrity, leading to increased productivity and maximum system performance.
Sanjay Bali, the Vice President of Strategy and Product Management for Synopsys EDA Group, highlighted the growing trend of enterprises moving towards multi-die designs to meet the increasing bandwidth demands for high-performance computing and artificial intelligence applications. Through a collaboration with Intel Foundry, Synopsys has developed an AI-powered multi-die reference pipeline for EMIB technology, offering customers a comprehensive solution to develop high-transistor count systems.
Synopsys provides a scalable multi-die solution for heterogeneous integration, supporting early architecture exploration, rapid software development, efficient die package co-design, robust inter-die connectivity, and improved reliability. The Synopsys 3DIC Compiler, integrated with Ansys RedHawk-SC electrothermal multiphysics technology, addresses critical thermal and power signal aspects for 2.5D/3D multi-die designs. The inclusion of Synopsys 3DSO.ai, an AI-powered optimization engine, enhances system performance and result quality for multi-die designs.
To streamline the creation of multi-die packages, Synopsys is developing IP for Intel Foundry process technologies. This IP facilitates the interconnections needed for multi-die packages, reducing integration risk and speeding up time to market. By combining Synopsys IP with the 3DIC Compiler, users can experience up to a 30% reduction in effort and a 15% improvement in result quality compared to traditional manual flows. This is achieved through automation of routing, interposer studies, and signal integrity analysis.
In conclusion, Synopsys is at the forefront of enabling the development of complex multi-die designs with their integrated solutions. By leveraging AI-powered technologies and partnerships with industry leaders like Intel Foundry, Synopsys is helping customers achieve higher levels of performance and efficiency in their multi-die systems. The comprehensive and scalable nature of Synopsys’ multi-die solution is tailored to meet the evolving demands of modern computing and AI applications.
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https://www.newelectronics.co.uk/content/news/synopsys-unveils-production-ready-multi-die-reference-flow-for-intel-foundry