By BV Swagath
Publication Date: 2026-10-15 08:09:00
IBM and Siemens have entered a research collaboration aimed at advancing nanostack, the chip maker’s three-dimensional transistor architecture capable of packing nearly 100 billion transistors onto a fingernail-sized chip.
The partnership brings together IBM’s semiconductor device research and Siemens’ capabilities in electronic design automation (EDA), process simulation, lithography optimisation, and advanced manufacturing software. Their joint objective is to compress development timelines and build the manufacturing groundwork required to move nanostack toward commercial production.