Siemens Digital Industries Software and Intel Foundry have officially certified Solido EDA software for utilization in Intel nodes 16 and 18A. This certification enables the implementation of an integrated multi-die interconnect bridge (EMIB), which can greatly enhance the performance, space efficiency, and energy efficiency of 3D-IC designs for customers in a more expedited manner.
Intel 18A represents the most recent node in Intel Foundry’s process technology roadmap, showcasing the RibbonFET GAA transistor architecture and PowerVia rear power delivery technologies. The inclusion of Open Model Interface (OMI) in both Intel 18A and Intel 16 nodes now allows for aging modeling and reliability analysis, supported by Siemens’ Solido Simulation Suite.
Additionally, Siemens has introduced the availability of the EMIB reference stream, aiding Intel Foundry customers in employing the foundry’s EMIB approach for high-density interconnection within heterogeneous chip packages. With Intel Foundry offering a Package Assembly Design Kit (PADK), customers utilizing EMIB can also leverage Siemens’ Caliber nmPlatform for validation of EMIB silicon designs, encompassing DRC, LVS, and 3D thermal analysis.
Mutual customers can engage in the planning, design, and verification of substrate and package systems utilizing Siemens’ Xpedition Substrate Integrator software, Xpedition Package Designer software, Hyperlynx SI/PI software, and Caliber 3DSTACK software. This suite of tools taps into Siemens’ semiconductor and integrated circuit packaging portfolios, providing capabilities for package assembly prototyping and plant planning through Xpedition Substrate Integrator, as well as predictive left-shift multiphysics analysis via Caliber.
In summary, the partnership between Siemens Digital Industries Software and Intel Foundry has resulted in the certification of Solido EDA software for Intel nodes 16 and 18A, facilitating the deployment of EMIB for enhanced 3D-IC designs. The integration of Open Model Interface in Intel nodes enables aging modeling and reliability analysis, while the availability of the EMIB reference stream streamlines high-density interconnection utilization. Mutual customers of Siemens and Intel can benefit from a comprehensive suite of software tools for substrate and package system planning, design, and verification, leading to improved efficiency in semiconductor and integrated circuit packaging processes.
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https://www.electronicsweekly.com/news/design/eda-and-ip/siemens-eda-for-intel-16-and-18a-nodes-2024-06/