Scaling Optical Interconnects with Co-Packaged Optics (CPO) in Margalit’s Vicinity

Scaling Optical Interconnects with Co-Packaged Optics (CPO) in Margalit’s Vicinity



Margalit is a leading expert in the field of optical interconnect technology, specifically focusing on the scaling of optical interconnects using co-packaged optics (CPO). CPO is a cutting-edge technology that involves integrating optical components directly into the package of a chip, allowing for high-speed and energy-efficient data transfer within data centers and other high-performance computing systems.

Broadcom Inc. is at the forefront of developing and implementing CPO technology, with Margalit playing a key role in this innovative approach to optical interconnect scaling. By utilizing CPO, Broadcom Inc. is able to significantly increase the bandwidth and efficiency of data transfer within its products, ultimately improving the performance and capabilities of data center and networking solutions.

Margalit’s expertise in CPO technology has allowed Broadcom Inc. to stay ahead of the curve in the rapidly evolving field of optical interconnects. With her knowledge and experience, Margalit has been able to drive advancements in CPO technology, making it a key focus for Broadcom Inc. as they continue to develop cutting-edge solutions for high-speed data transfer and networking.

Overall, Margalit’s contributions to the field of optical interconnect technology, particularly in the area of CPO, have been instrumental in advancing the capabilities of data center and networking solutions. Her expertise and leadership at Broadcom Inc. have helped to optimize data transfer speeds and efficiency, ultimately benefiting a wide range of industries and applications that rely on high-speed data processing.

Article Source
https://www.broadcom.com/blog/how-to-scale-the-optical-interconnect-using-co-packaged-optics-cpo