Samsung Prepares 8-Layer HBM4 as Nvidia Rethinks Its Memory Plans

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Samsung Prepares 8-Layer HBM4 as Nvidia Rethinks Its Memory Plans

By Binay Konwar
Publication Date: 2026-10-26 09:06:00

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October 26, 2026 • 2 min read

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Samsung appears to be preparing a different version of its HBM4 for Nvidia. The company reportedly plans to begin mass production of 8-layer HBM4 chips around Q2 2027. This comes as Nvidia rethinks the memory setup for its upcoming Rubin Ultra AI accelerator.

Nvidia’s Rubin Ultra plans push demand for 8-layer HBM4

According to a report from ZDNet Korea, Samsung and SK Hynix are targeting mass production and shipments of 8-layer HBM4 for Nvidia in the second quarter of 2027. Right now, both memory makers mainly make 12-layer HBM4.

For the uninitiated, HBM stacks multiple DRAM chips vertically and connects them with Through-Silicon Via (TSV) technology. A 12-layer product features 12 stacked DRAM dies, while an 8-layer version packs eight.

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Nvidia originally planned to use 12-layer HBM4E, the seventh-generation HBM, in its Rubin Ultra….