Samsung announced that it has developed the industry’s first 512GB memory module using its latest DDR5 memory devices that use high-k dielectrics as isolators. The new DIMM is designed for next-generation servers using DDR5 memory, including those powered by AMD’s Epyc ‘Genoa’ and Intel’s Xeon Scalable ‘Sapphire Rapids’ processors.
Samsung’s 512 GB DDR5 registered DIMM memory module (RDIMM) uses 32 16 GB stacks based on eight 16 Gb DRAM devices. The 8-Hi-Stacks are used over silicon via interconnects to ensure signal transmission with low power consumption and low quality. For some reason, Samsung does not disclose the maximum data transfer rate supported by RDIMM. This is not entirely unexpected as the company is unable to disclose specifications for next generation server platforms.
What’s interesting about Samsung’s 512GB RDIMM is that it uses the company’s latest 16Gb DDR5 memory devices that replace traditional isolators with a high-k material that was originally used for logic gates to reduce leakage current. This is not the first time Samsung has used HKMG technology for memory as it was used for high-speed GDDR6 devices back in 2018. In theory, using HKMG could help Samsung’s DDR5 devices achieve higher data transfer rates as well.
According to Samsung, the DDR5 devices consume 13% less power than their predecessors due to the reduced voltages of the DDR5, the HKMG insulating layer and other improvements, which will be especially important for the 512 GB RDIMM for servers.
When used with server processors with eight memory channels and two DIMMs per channel, you can use the new 512 GB memory modules from Samsung to equip any CPU with up to 8 TB of DDR5 memory, up from 4 TB today.
Samsung has already started testing various DDR5 modules with various partners from the server community. The company expects its next generation DIMMs to be validated and certified by the time servers that bring DDR5 memory to market.
“Intel’s development teams are working closely with leading memory companies like Samsung to deliver fast, low-power DDR5 memory that is performance-optimized and compatible with our upcoming scalable Intel Xeon processors, codenamed Sapphire Rapids,” said Carolyn Duran, vice president and GM for memory and I / O technology at Intel.