The competition in the semiconductor industry is heating up as Samsung Electronics, TSMC, and Intel race to secure next-generation Extreme Ultraviolet (EUV) lithography equipment. TSMC’s CEO recently visited ASML in the Netherlands to discuss the equipment, marking the beginning of competition for sub-2nm ultrathin processes. TSMC is considering introducing High NA EUV equipment for their 1.6nm product, A16, which is set for mass production in the second half of 2026.
Meanwhile, Intel received High NA EUV equipment from ASML last year, making them the first in the industry to do so. Intel is expected to fully utilize this equipment in their semiconductor process. Samsung Electronics is also active in this competition, with Chairman Lee Jae-yong meeting with ASML CEO and a key partner at Zeiss headquarters to strengthen alliances. Samsung is also looking to introduce High NA EUV equipment for their processes.
Overall, the increasing importance of lithography equipment in sub-7nm ultrathin processes has pushed these major players to secure next-generation equipment. TSMC, Intel, and Samsung Electronics are all vying for dominance in the semiconductor industry by investing in advanced technologies like EUV lithography. This competition is crucial for staying ahead in the fast-paced world of semiconductor manufacturing.
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