Revolutionary AI Chip Breakthrough: Broadcom’s New 200G Solution Slashes Power Usage by 20%

Revolutionary AI Chip Breakthrough: Broadcom’s New 200G Solution Slashes Power Usage by 20%








Broadcom (NASDAQ: AVGO) has expanded its 200G/lane DSP PHY portfolio with two new products: Sian3 and Sian2M, designed for AI/ML cluster connectivity. The Sian3, a 3nm PAM4 DSP PHY, delivers over 20% power reduction for 1.6T optical modules, while Sian2M specializes in short-reach MMF links with integrated VCSEL drivers.

These innovations address increasing bandwidth demands in AI infrastructure, with Sian3 enabling sub-13W 800G and…

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