Semiconductor chip construction is evolving with the adoption of new 3D stacking technologies that enhance chip density beyond traditional methods. Nvidia’s collaboration with Ansys in using the Omniverse platform for analyzing 3D semiconductor designs offers major advantages for chip designers. By utilizing Nvidia’s Fourier module neural operator architecture, Ansys can predict power profiles and simulate temperatures across the chip to detect hot spots. This allows engineers to gain better insights into how the chip will perform under different conditions. 3D visualization helps identify hot spots and resolve electromagnetic issues more efficiently compared to traditional 2D methods.
Ansys will showcase its 3D design software at the Design Automation Conference, highlighting the use of Nvidia’s Modulus Fourier neural operator architecture to create AI-generated tools for testing 3D stacked chip designs. This collaboration aims to predict temperature profiles based on system parameters like heat transfer coefficient and material properties, aiding in detecting thermal issues prior to prototype production.
The use of Nvidia’s Omniverse platform in chip design is gaining traction among leading manufacturers due to its ability to replicate real-life scenarios in a virtual 3D environment. Viewing chip designs in 3D is a promising approach for future chip development, especially for 3D stacked chips. By leveraging advanced technologies and AI-generated tools, companies like Ansys and Nvidia are driving innovation in semiconductor chip design.
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