In a recent report from Taiwan, it was revealed that NVIDIA is taking steps to optimize the supply chain for their latest AI chips. The report suggests that NVIDIA’s Blackwell GPUs, known for their high performance in AI applications, may start using panel-level fan-out packaging for their GB200 GPU earlier than anticipated in 2025.
The semiconductor manufacturing process involves intricate steps such as circuit deposition and printing on silicon wafers, followed by packaging the chips with other components for processing AI workloads. Currently, the industry standard for packaging is fan-out packaging at the wafer level, where chips are cut from the wafer and reassembled onto another wafer for further circuit design.
Fan packaging offers advantages such as eliminating defective chips from the packaging process. The report mentions that FOPLP, a variant of fan packaging, involves reassembling chips into larger panels instead of wafers, allowing for increased packaging efficiency and cost reduction. Taiwanese companies like PowerTech and Innolux are developing panel-level packaging technologies, with Innolux aiming for mass production later this year.
The report also highlights NVIDIA’s weak capacity for CoWoS packaging for Blackwell products, leading to speculation that the GB200 GPU could adopt FOPLP ahead of schedule in 2025 instead of 2026. The use of a glass substrate in the chips is expected to enhance thermal resistance and maintain optimal performance under high temperatures. Sources suggest that around 420,000 GB200 chips will be delivered in the second half of the year, with production set to increase to two million units in 2025.
Overall, NVIDIA’s shift towards panel-level fan-out packaging for their AI chips aims to diversify chip design and address potential shortages in the semiconductor supply chain. By leveraging advanced packaging technologies, NVIDIA is looking to enhance performance, reduce costs, and meet the growing demand for AI products in the market.
Article Source
https://wccftech.com/nvidia-might-shift-to-improved-foplp-packaging-for-a-i-chips-in-2025-report/
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