Rapidus has partnered with IBM to utilize their packaging technology for high-performance semiconductors. The collaboration aims to facilitate further innovation in the semiconductor industry. Rapidus CEO Atsuyoshi Koike expressed enthusiasm about the international partnership and highlighted the potential for Japan to enhance its presence in the semiconductor packaging supply chain.
This collaboration is part of the larger project led by the Japan New Energy and Industrial Technology Development Organization (NEDO) focused on developing design and manufacturing technology for 2nm generation semiconductors. The agreement builds on Rapidus’ existing partnership with IBM for joint development of 2nm node technology. Both companies are committed to advancing semiconductor technology through their combined expertise and resources.
The integration of IBM’s packaging technology into Rapidus’ semiconductor production process marks a significant step forward in achieving high-performance chipsets. By leveraging IBM’s innovative solutions, Rapidus aims to enhance the efficiency and capabilities of its semiconductor products. This collaboration reflects the companies’ shared commitment to driving technological advancement in the semiconductor industry.
Through this partnership, Rapidus and IBM are positioned to lead the way in developing cutting-edge semiconductor technology. By pooling their resources and knowledge, the companies are well-equipped to address the challenges of producing 2nm generation semiconductors. Their collaboration is expected to yield groundbreaking advancements in semiconductor design and manufacturing processes.
Rapidus’ collaboration with IBM underlines the importance of international partnerships in driving innovation and competitiveness in the semiconductor industry. By leveraging each other’s strengths and capabilities, the companies can accelerate the development of next-generation semiconductor technologies. This collaboration showcases the power of collaboration in advancing semiconductor technology and ensuring Japan’s continued leadership in the global semiconductor market.
Overall, the partnership between Rapidus and IBM represents a significant milestone in the semiconductor industry. The collaboration is poised to bring about transformative advancements in semiconductor design and manufacturing processes. By joining forces, Rapidus and IBM are well-positioned to make significant contributions to the development of 2nm generation semiconductors and propel the industry forward.
Article Source
https://www.electronicsweekly.com/news/business/rapidus-and-ibm-hook-up-on-chiplet-packaging-2024-06/
