IBM and Fast have recently announced a partnership to jointly develop cutting-edge chiplet packages. This collaboration aims to establish mass production technologies for high-performance semiconductors, with Rapidus benefiting from IBM’s advanced packaging technology. The two companies will work together to drive innovation in this area. The agreement is part of a larger international project led by NEDO, focusing on the development of chipsets and packages for 2nm generation semiconductors.
As part of the partnership, IBM and Rapidus engineers will collaborate at IBM’s facilities in North America to research and manufacture semiconductor packaging for high-performance computing systems. IBM brings years of experience in research and development, as well as manufacturing technologies for semiconductor packaging. The company has a strong track record of successful co-development partnerships with Japanese semiconductor manufacturers, as well as companies involved in package manufacturing equipment and materials. Rapidus seeks to leverage IBM’s expertise to advance chip packaging technology.
The joint development agreement builds on an existing partnership between IBM and Rapidus for the development of 2nm node technology. This new collaboration will allow both companies to combine their resources and knowledge to push the boundaries of semiconductor packaging. By working together, IBM and Rapidus aim to accelerate the adoption of advanced chiplet packages in the market.
Overall, the partnership between IBM and Fast signals a commitment to advancing semiconductor technology through collaboration and innovation. By pooling their expertise and resources, the two companies have the potential to make significant advancements in chip packaging technology. This partnership also underscores the importance of international collaboration in the semiconductor industry, as companies from different regions come together to drive progress and deliver cutting-edge solutions to the market.
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https://www.tipranks.com/news/the-fly/rapidus-ibm-expand-collaboration-to-chiplet-packaging-technology
