Rapidus Corporation, a manufacturer of advanced logic semiconductors, and IBM have announced a joint development partnership to work on chiplet packages. This collaboration aims to establish mass production technologies for chiplet packages, with Rapidus receiving IBM packaging technology for high-performance semiconductors. The two companies will work together to innovate in this space, continuing their existing collaboration for 2nm node technology.
This agreement is part of an international collaboration as part of the project “Development of design and manufacturing technology for chipsets and packages for 2nm generation semiconductors” by Japan New Energy and Industrial Technology Development Organization (NEDO). IBM and Rapidus engineers will collaborate at IBM facilities in North America for research and development and manufacturing of semiconductor packaging for high-performance computing systems.
IBM has significant experience in research, development, and manufacturing technologies for semiconductor packaging, especially for high-performance computing systems. They have worked with Japanese semiconductor manufacturers and other related companies, leveraging this expertise to establish cutting-edge chip packaging technology. Rapidus aims to benefit from this experience to innovate and enhance Japan’s role in the semiconductor packaging supply chain.
Rapidus President and CEO, Dr. Atsuyoshi Koike, expressed enthusiasm for the partnership and their joint efforts in chiplet packaging technology. IBM’s Senior Vice President and Director of Research, Darío Gil, reiterated their commitment to supporting the development of advanced node production, design, packaging processes, and workforce in the semiconductor industry through this collaboration.
IBM is a global leader in hybrid cloud, artificial intelligence, and consulting services, serving clients in over 175 countries. They help businesses optimize processes, gain insights from data, reduce costs, and gain a competitive edge. IBM’s innovations in artificial intelligence, quantum computing, industry-specific cloud solutions, and consulting offer flexible options for clients while upholding core values of trust, transparency, accountability, and inclusion.
Rapidus Corporation focuses on developing and manufacturing cutting-edge logic semiconductors, aiming to shorten production cycle times and contribute to new industries. They work with customers to enhance semiconductor production processes and benefit society. The partnership between Rapidus and IBM signifies a step towards technological advancements in chiplet packaging, facilitated through international collaboration.
For media inquiries, please contact Kreab KK in Japan or Separatist Communications in the US. Visit Rapidus Corporation’s website for more information on their initiatives and projects.
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https://www.prnewswire.com/news-releases/rapidus-and-ibm-expand-collaboration-to-chiplet-packaging-technology-for-2nm-generation-semiconductors-302162700.html
