In July 2023, it was reported that Google had switched from Samsung to TSMC for the Tensor G5 chip, with further confirmation indicating progress towards the Pixel 10. Originally, Google had planned to launch its first fully custom chip in 2024, but missed deadlines led to a shift to 2025 for the “Laguna” chip, based on TSMC’s 3-nanometer manufacturing process with integrated Fan-Out technology for increased power efficiency.
A commercial database recently revealed details about the nature of TSMC and InFO_PoP, including a 3D wafer-level package with high-density RDL and TIV to integrate mobile AP with DRAM package stacking for better performance in mobile applications. The first iteration of the Tensor G5 chip features 16 GB of RAM from Samsung, similar to the Pixel 9 Pro, to support on-device generative AI like the upcoming multimodal capabilities of Gemini Nano.
It is interesting to note that Google in Taiwan is the exporter, while Tessolve Semiconductor in India serves as the importer, highlighting the company’s hardware engineering presence in Taiwan and the location of most of Tensor’s silicon engineers in India. Despite the delays in development, the new chips were intended to complement the new design language of the Pixel 9, emphasizing Google’s advancement in phone technology.
However, the current Tensor G4 chip is considered a minor update still manufactured by Samsung, casting a shadow over this year’s phone offerings. While the new design and features may be appealing, the delay in a better chip may leave consumers waiting for an improved product in the following year.
Overall, Google’s shift to TSMC for the Tensor G5 chip marks a significant step towards technological advancement in its smartphone lineup. With plans for the Pixel 10 underway, the company continues to innovate and improve its custom chip designs, setting the stage for more powerful and efficient devices in the future.
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https://9to5google.com/2024/05/25/pixel-10-tensor-g5-tsmc/