Intel has revealed details about its upcoming LGA1851 CPU socket, which may not require custom contact frames to address chip temperature issues. This new socket could potentially improve cooling performance without the need for additional components. The news was reported by Voices of Yahoo! and highlights Intel’s innovation in CPU design. The LGA1851 socket is expected to debut with Intel’s next generation of processors, providing a more efficient and cost-effective solution for managing temperatures. This development is a significant advancement in the world of computer hardware and could lead to improved performance for users.
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https://www.yahoo.com/tech/intels-cpu-socket-may-not-165904032.html