By Hassan Mujtaba
Publication Date: 2026-05-09 14:00:00
NVIDIA’s Rubin platforms are rumoredly facing design/spec issues, making way for the competition, such as AMD MI500, to get the headstart with HBM4E in 2027.
Will AMD Beat NVIDIA In The Race To HBM4E? Design & Spec Changes In Rubin Platforms Can Give MI500 The Lead
Based on recent reports, NVIDIA’s upcoming Rubin and Rubin Ultra platforms are undergoing serious design and spec changes. These changes come ahead of the expected launch of the Rubin generation, which is going to uplift AI performance miles above Blackwell with new features, efficiency upgrades & brand new architectures.
As per the rumors, NVIDIA is facing five critical challenges for the Rubin and Rubin Ultra platforms. These include speed and capacity drawbacks of HBM4 memory, yields, and warpage issues, multi-power design pushback, and redesigning of the heatspreader.
HBM4 Speeds Scaled-Back
Starting with the HBM4 challenges, NVIDIA’s Rubin platform features 288 GB of HBM4 memory with up to 22 TB/s of total bandwidth. Micron has already announced volume production of 12-Hi HBM4 memory to power NVIDIA’s Rubin platforms, offering up to 2.8 TB/s of bandwidth per stack of 22.4 TB/s across eight HBM4 stacks.
It is stated that NVIDIA is facing challenges in getting higher-speed memory to work with Rubin due to poor base die quality from Micron and SK Hynix, which can lead to a design change or a potential delay in the production cycle.
