By BigGo Finance
Publication Date: 2026-10-12 20:55:00
Graphics processing unit leader Nvidia and networking equipment giant Cisco on October 12 jointly announced USFP, a next-generation ultra-high-density pluggable optical module specification. The first planned product will support 400Gb/s electrical signaling per lane, quadrupling bandwidth density compared to current 200Gb/s solutions and setting a new benchmark for AI data center interconnect architectures.
The two companies announced they have begun collaborating with connector suppliers TE Connectivity and Amphenol to develop the cages, connectors, and module hardware required for USFP, and plan to advance USFP as an open industry standard through a community-led multi-source project. The initiative aims to address interconnect bottlenecks arising from the continued expansion of AI factories, enabling operators to scale compute capacity without adding network tiers.
Technical Breakthrough: 400Gb/s Per Lane
The core breakthrough of USFP lies in pushing single-lane electrical…
