By TechPowerUp
Publication Date: 2025-12-18 17:09:00
NVIDIA and AMD are reportedly evaluating Intel Foundry’s 14A node, while Apple and Broadcom are considering Intel’s EMIB packaging for a custom server accelerator. According to GF Securities Hong Kong, these developments reflect a growing willingness among top designers to reconsider their sources for both front-end process technology and back-end assembly. Capacity limits at alternative suppliers like TSMC are likely a key factor prompting these exploratory moves, with packaging availability now a central constraint for large design houses.
Closer to Apple, supply chain reports indicate the company has engaged Intel for process evaluation and is weighing alternative packaging routes. Apple has reportedly worked with version 0.9.1 of the 18A-P process design kit and is awaiting PDK 1.0 or 1.1, expected in the first quarter of 2026, before moving into larger scale tests. The Broadcom-assisted “Baltra” server design was originally linked to TSMC’s N3 3 nm processes, but limited CoWoS…
