[News] TSMC, Samsung, and Intel Enter New Battleground in Panel-Level Packaging | TrendForce Insights

The semiconductor industry is witnessing a shift towards panel-level packaging, with TSMC, Intel, and Samsung investing in this technology. TSMC, a prominent wafer foundry, is exploring panel-level packaging to accommodate more chipsets on a single rectangular substrate, replacing the traditional circular wafer. This move is driven by the anticipated increase in demand for AI technologies in the future.

TSMC’s research in this area is still in the early stages and may take several years before commercialization. The company faces challenges in transitioning to rectangular substrates, requiring significant time, effort, and upgrades to production tools and materials. Currently, TSMC is experimenting with rectangular substrates that offer more than three times the usable area of a 12-inch wafer, aiming to enhance chip packaging capacity.

Samsung and Intel are also venturing into advanced packaging technologies to address the limitations of conventional packaging methods. Samsung offers various packaging services for different applications, such as mobile phones and wearable devices, including panel-level and wafer-level distribution packages. Intel is developing a glass substrate solution for next-generation packaging, targeting markets like data centers, artificial intelligence, and graphics processing.

The semiconductor giants’ investments in advanced packaging technologies signify a strategic move to stay competitive and meet the evolving demands of the industry. As chips become more complex and integrate additional features like memory, the current packaging solutions may not suffice in the coming years. By exploring innovative packaging methods, these companies aim to stay at the forefront of technological advancements and cater to diverse market needs.

In conclusion, the semiconductor industry is witnessing a paradigm shift towards panel-level packaging, driven by the increasing demand for AI technologies. TSMC, Intel, and Samsung are at the forefront of this transformation, investing in advanced packaging technologies to enhance chip performance and efficiency. This strategic move reflects the industry’s commitment to innovation and adaptation to emerging trends, ensuring continued growth and competitiveness in the semiconductor market.

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https://www.trendforce.com/news/2024/06/21/news-new-battleground-for-tsmc-samsung-intel-in-panel-level-packaging/