[News] SOCAMM2 War Heats Up: Samsung Reportedly Delivers Samples to NVIDIA, Ramping Early 2026

While Micron confirmed at its earnings call that it has sampled its 192GB LP SOCAMM2, other memory leaders are ramping up their efforts. Yonhap News reports that Samsung has also developed SOCAMM2, an LPDDR-based server memory module, and has already delivered samples to AI powerhouse NVIDIA, with strong interest reportedly coming from other major customers.

The report highlights that SOCAMM2 is expected to power NVIDIA’s next-gen AI chip, Vera Rubin. Meanwhile, ZDNet suggests Samsung’s SOCAMM2 is expected to enter full-scale commercial production in early 2026, adding that it has developed the module based on 1b (5th-generation 10nm-class) DRAM and is currently conducting quality tests.

ZDNet explains that the SOCAMM2 (Small Outline Compression Attached Memory Module) packs four LPDDR chips per module, delivering over double the bandwidth of traditional RDIMMs while slashing power consumption by 55%. Its modular design enables easy replacement and upgrades—eliminating the need to solder LPDDR directly onto motherboards, the report adds.

As per the Korea Herald, while HBM stacks DRAM chips vertically, SOCAM combines multiple low-power DRAM (LPDDR) modules. The report notes that HBM attaches to NVIDIA GPUs to boost computational speed, whereas SOCAM integrates with CPUs to cut power consumption.

SK hynix, Micron Ramp up Efforts

In September, Etoday and DealSite indicate that…