[News] Samsung HBM4 Reportedly Beats Expectations in Broadcom Test, Set to Lead 2026 Google TPU Supply

Google’s TPU is gaining traction as a strong alternative to NVIDIA, and Samsung is emerging as a beneficiary of the growing ASIC trend. According to Chosun Biz, Samsung Electronics is supplying HBM to Broadcom, the world’s largest ASIC design company, and its sixth-generation HBM (HBM4) has reportedly surpassed Broadcom’s initial performance targets in testing.

Sources cited in the report note that Samsung’s HBM4, expected to go into full supply in 2026, has outperformed its early performance targets in Broadcom’s evaluations. After falling behind SK hynix in prior years, Samsung has attempted to differentiate its HBM4 offering by enhancing both its DRAM and logic die technologies. Thus far, the broader semiconductor industry has offered largely favorable assessments, the report adds.

Samsung is currently supplying its fifth-generation HBM3E, primarily 8-high stacks, for Google’s…