Despite U.S. trade restrictions, China’s domestic semiconductor production remains strong, with Loongson recently announcing the successful return of samples for its new server processor series, the Loongson 3C6000/3D6000/3E6000. This series is set to launch in the fourth quarter of 2024 and boasts impressive performance improvements over its predecessors. The 3C6000 design features a single chip with 16 cores and 32 threads, offering a better price-performance ratio for server CPUs. The chip includes a six-core LA664 processing core, increased memory bandwidth, improved I/O performance, and support for high-speed encryption calculations.
Additionally, the 3D6000 and 3E6000 models in the series connect multiple 3C6000 chips to create processors with even higher core and thread counts. The use of chiplet architectures, similar to technologies by Nvidia and AMD, enables efficient core cache coherent interconnects and dynamic device allocation. Loongson’s Coherent Link technology supports chip interconnection and upgrades, making it compatible with major PCIE hardware ecosystems.
Although independent verification of the 3C6000’s performance is not available, Loongson continues to make advancements in semiconductor technology within regulatory constraints. By leveraging its MIPS-based LoongArch ISA and local Chinese fabs, Loongson is narrowing the gap with competitors like EPYC and Xeon chips.
In summary, China’s semiconductor industry is making significant progress despite U.S. trade restrictions. Loongson’s upcoming server processor series, the Loongson 3C6000/3D6000/3E6000, showcases improvements in performance and chip architecture. The use of chiplet technology and Coherent Link interconnects position Loongson as a competitor in the global semiconductor market. Despite challenges, the company continues to innovate and develop cutting-edge semiconductor products.
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