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Intel’s Jaykihn recently provided a detailed overview of the LGA-1851 socket, emphasizing its connectivity options for components on the motherboard. This unveiling coincides with Intel’s upcoming Arrow Lake series launch, featuring both desktop (S) and mobile (HX) variants with similar input/output capabilities.
The mobile HX variant packs desktop-level CPU capabilities into a BGA package, with an additional USB2 lane to meet the specific I/O needs of high-performance gaming laptops and mobile workstations. Both the desktop Core Ultra 200K series and mobile Core Ultra 200HX series support PCIe Gen5 for graphics, even though initial models may not feature cards that utilize this standard. However, the adoption of PCIe Gen5 is expected to increase, particularly for storage applications where a minimum 4-lane connection will become standard on Intel devices.
Intel’s roadmap also includes low-power variants like the Arrow Lake-H and Lunar Lake Core Ultra 200V series. The Arrow Lake-H variant reduces PCIe Gen5 lanes to 8 to align with common mobile graphics requirements, while the Lunar Lake variant supports PCIe Gen5 with 4 lanes for SSD configurations.
The LGA-1851 socket pinout map offers vital information about pad connections and the role of the socket in connecting the CPU to other components on the motherboard. Understanding this map is essential for identifying potential socket issues, although any repairs should be done by professionals with the appropriate tools.
In terms of product launches, the first Core Ultra 200 products are expected to debut in late Q3 with the Lunar Lake variant, followed by the Arrow Lake series rollout from Q4 2024 to Q1 2025, introducing both desktop and mobile versions of the Core Ultra 200 series gradually.
The Arrow Lake-S desktop platform’s SoC and IOE configurations are outlined, showcasing PCIe Gen5 lanes and various connections for core functions. The Arrow Lake-HX mobile platform offers similar configurations but with an additional USB 2.0 lane to accommodate mobile needs. The Arrow Lake-H mobile platform provides different PCIe and USB configurations, tailored for mobile use. The Lunar Lake low-power platform (Core Ultra 200V) introduces UFS support for enhanced performance and storage efficiency on low-power devices.
The official presentation of the Lunar Lake processors is expected in the third quarter, featuring the Core Ultra 200V series with UFS support. This addition aims to enhance performance and storage capabilities on low-power devices.
Overall, the detailed pinout and I/O specifications for the LGA1851 socket and Core Ultra 200 series processors highlight Intel’s commitment to innovation in processor technology, offering improved performance and connectivity options for desktop and mobile platforms. As the launch date nears, more information from benchmark testing is likely to provide additional insights into the capabilities and applications of these new processors.
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https://www.guru3d.com/story/intel-lga1851-lga1851-socket-pinout-and-core-ultra-200-series-i-o-specifications-leak/