Intel’s 3nm-class process technology is now in high-volume production.

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Intel’s 3nm-class process technology is now in high-volume production.


Intel announced on Wednesday that its Intel 3 3nm-class process technology has begun high-volume production at two locations and shared some details about the new production node. The new process offers improved performance and higher transistor density, supporting voltages of 1.2 V for ultra-high-performance applications. It is designed for use in Intel’s own products as well as for foundry customers and will continue to evolve in the future.

According to Walid Hafez, vice president of foundry technology development at Intel, Intel 3 is already being manufactured at high volume in the company’s Oregon and Ireland factories, including the newly launched Xeon 6 ‘Sierra Forest’ and ‘Granite Rapids’ processors.

Intel has positioned its Intel 3 manufacturing process for data center applications that require cutting-edge performance, achieved through refreshed transistors and improved power delivery circuits. The production node supports voltages ranging from low to high for maximum loads. Intel guarantees that the new node will deliver 18% higher performance with the same power and transistor density compared to its predecessor, Intel 4.

To maximize performance and density benefits, chip designers will need to utilize a combination of high-performance 240nm and high-density 210nm libraries. Customers can also choose from three metal stack options for cost, performance, or a balance between the two.

Initially, Intel will utilize its 3nm process technology to power its Xeon 6 processors in data centers. In the future, Intel Foundry plans to use the production node to manufacture data center-grade processors for its clients.

In addition to the base Intel 3 process, Intel will offer variations such as Intel 3T, which supports silicon vias, for use as a base. Future offerings include Intel 3-E with enhanced features for chipsets and storage applications, and Intel 3-PT with improved performance suitable for a variety of workloads, from AI/HPC to general desktop PCs.

Overall, Intel’s Intel 3 3nm-class process technology represents a significant advancement in performance and transistor density, catering to the demands of data center applications and providing flexibility for a wide range of computing needs. With high-volume production already underway, Intel is poised to deliver cutting-edge processors and continue to innovate in the semiconductor industry.

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