Intel recently showcased a cutting-edge optical data bridge that uses photons for data transfer instead of traditional electrons. This technology, known as the Optical Compute Interconnect (OCI) chiplet, was unveiled at the 2024 Optical Fiber Communications Conference (OFC). The OCI chiplet is the industry’s most advanced optical interconnect chiplet and the first of its kind to handle live data transmission. It was demonstrated in conjunction with an Intel CPU but has the potential to be used with other CPUs, GPUs, IPUs, and SoCs.
The OCI chiplet is specifically designed for advanced AI infrastructure and high-performance computing applications, offering transmission speeds of 32 gigabits per second in each direction with a range of up to 100 meters. This technology is aimed at addressing the increasing demand for data transfer between servers in data centers, as current solutions are reaching their limits of performance. By utilizing photons instead of electrons, Intel’s OCI chiplet promises to increase bandwidth, reduce power consumption, and extend the range of data transmission.
Thomas Liljeberg, Senior Director of Strategy and Product Management for Intel’s Integrated Photonics Solutions Group, emphasized the significance of this breakthrough technology in revolutionizing high-performance AI infrastructure. The OCI chiplet’s innovative design incorporates a silicon photonics integrated circuit (PIC) with a power IC, enabling bi-directional data transfer rates of 4 terabits per second. Intel Labs has been a pioneer in silicon photonics technology and was the first to introduce silicon photonics-based products to the market.
The rise of powerful AI technologies, such as large language models and generative AI, has fueled the need for increased bandwidth in AI-accelerated workloads. The OIC chiplet from Intel is positioned to meet this demand by providing a scalable solution for future computing fabric and supporting larger processing units. By utilizing photons for data transfer, Intel’s OCI chiplet offers a significant improvement in data transfer speed and efficiency compared to traditional electron-based systems.
In conclusion, Intel’s demonstration of the OCI chiplet marks a significant advancement in optical interconnect technology, with the potential to revolutionize data exchange in high-performance computing and AI applications. This innovative technology holds promise for improving data transfer speeds, reducing power consumption, and extending the reach of data transmission in advanced computing systems. As the demand for high-performance AI infrastructure continues to grow, Intel’s OCI chiplet is poised to play a key role in enabling faster and more efficient data transfer in the future.
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