Intel has made a significant breakthrough in integrated photonics technology for high-speed data transmission, as announced at the 2024 Fiber Optic Communication Conference. The company’s Integrated Photonic Solutions (IPS) Group unveiled an integrated optical computing interconnect (OCI) chiplet that can support 64 channels of 32 gigabits per second (Gbps) data transmission in each direction over optical fiber up to 100 meters. This technology is aimed at meeting the demands of higher bandwidth AI infrastructure, lower power consumption, and longer range for future CPU/GPU cluster connectivity and innovative computing architectures.
The OCI chiplet integrates Intel’s silicon photonics technology, featuring a silicon photonics integrated circuit (PIC) with on-chip lasers and optical amplifiers, combined with an electrical IC. The chiplet enables bidirectional data transfers of up to 4 terabits per second (Tbps) supporting Gen5 PCIe, with a demonstration showcasing optical transmission spectrum and high-quality signal output at 32Gbps transmission speed.
Intel’s OCI chiplet represents a power-efficient solution, consuming only 5 picojoules (pJ) per bit compared to around 15 pJ/bit for pluggable optical transceiver modules. This efficiency is crucial for data centers and high-performance computing environments, addressing the increasing power demands of AI workloads.
The OCI chiplet leverages over 25 years of integrated photonics research from Intel Labs, and the company emphasizes its role in advancing silicon photonics-based connectivity products for major cloud service providers. Intel’s goal is to seamlessly integrate packaged silicon photonic interconnect solutions into next-generation computing systems, increasing bandwidth, reducing power consumption, and enhancing range for machine learning workload acceleration.
The company’s approach to integration using hybrid laser-on-wafer technology and direct integration results in higher reliability and cost-effectiveness, setting Intel apart in the industry. The robust platform has deployed PICs into pluggable transceiver modules for large data center networks, with advancements in laser-on-chip technology and enhanced device performance.
Intel is working with select customers to develop package solutions with their Systems-on-Chip (SoCs) to incorporate optical I/O solutions. The company continues to innovate in silicon photonics technology, deploying a new factory process node to improve device performance, density, coupling, and economics for future applications.
Overall, Intel’s OCI chiplet signifies a significant advancement in high-speed data transmission and a crucial development for the evolving AI infrastructure landscape. By driving innovation in connectivity solutions, Intel is shaping the future of AI acceleration workloads and enabling scalable computing platforms to meet the demands of emerging AI requirements.
Article Source
https://insidehpc.com/2024/06/intel-demonstrates-integrated-optical-i-o-chiplet/
