Intel is set to introduce the LGA-1851 socket, which will offer two different loading mechanisms – the traditional ILM solution and RL-ILM (Reduced Load ILM) for better thermal performance. The RL-ILM is optional and costs just $1 more than the default configuration, promising improved cooling capabilities. However, there is a compatibility risk as the cooling heatsink will need to apply a minimum of 35 pounds of load force to the processor in the RL-ILM configuration. This means users may need to use coolers that are compatible with the loading mechanism.
The upcoming LGA-1851 socket represents a significant departure from the previous LGA 1700 socket, with changes in pin layout and loading mechanisms. Intel has designed the RL-ILM to tackle cooling challenges faced by previous generations of CPUs and to improve thermal performance without compromising compatibility. The RL-ILM is targeted towards vendors looking to cater to high-end overclockers who require enhanced cooling solutions.
The shift to the LGA-1851 socket includes minor dimension changes compared to the LGA 1700, with a 0.8mm upward shift on the motherboard and a slight increase in height from the motherboard to the IHS. The new socket is expected to launch with the Z890 PCH motherboards for Arrow Lake-S desktop CPUs in October 2024, with budget and mainstream models to follow in early 2025. The LGA-1851 socket will be compatible with future generations of Intel CPUs, including the Panther Lake line.
Overall, the LGA-1851 socket promises improved thermal performance and compatibility with a focus on high-end overclockers and system vendors. While the optional RL-ILM configuration offers enhanced cooling capabilities, users need to consider the compatibility requirements and use coolers that are designed to handle the increased load force on the processor. Intel’s commitment to addressing cooling challenges and improving performance with the LGA-1851 socket marks a significant advancement in CPU technology.
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