Intel has recently announced that its 3nm technology is now being produced in high volumes at its Leixlip facility. This advanced technology is utilized for manufacturing Xeon 6 processors and providing foundry wafers to customers. The new process offers a significant improvement in performance, with up to 18 percent better performance for the same power consumption compared to the previous Intel 4 process.
Walid Hafez, the vice president of foundry technology development at Intel, expressed excitement about the progress, stating that it represents a major performance improvement in just one year. Intel’s goal of introducing five process nodes in four years, known as the 5N4Y strategy, is nearing completion with the successful production of the 3nm technology.
The Intel 3 technology comes in various versions to cater to different applications. Intel 3-T incorporates silicon vias (TSV) for 3D stacking applications, such as image processing, high-performance computing, and artificial intelligence. Intel 3-E introduces I/O for external interfaces, along with analog and mixed signal capabilities. Intel 3-PT merges all previous versions to further enhance performance and design simplicity, with support for denser 3D stacking through finer pitch TSVs and hybrid bonding techniques.
The company aims to provide a durable node for foundry customers, continuing to advance technology features and performance to meet a variety of design and product requirements. Hafez also mentioned that Intel is making progress according to its 5N4Y strategy and preparing for the next advancements with the upcoming introduction of the Intel 20A and Intel 18A process nodes.
Overall, Intel’s Leixlip facility is at full speed with the production of the 3nm technology, offering improved performance and capabilities for a range of applications. The company’s commitment to innovation and advancement is exemplified through its 5N4Y strategy and ongoing development of cutting-edge technologies to meet the evolving needs of the industry.
Article Source
https://www.fudzilla.com/news/59204-intel-3nm-production-going-hell-for-leather