Intel introduces new ‘optical computing interconnect’ chiplet enabling data transmission with light over 100 times longer distance

Intel introduces new ‘optical computing interconnect’ chiplet enabling data transmission with light over 100 times longer distance


Intel recently announced a breakthrough in optical computing interconnect (OCI) technology with the demonstration of a fully integrated OCI that combines optical input/output chiplets with a CPU. This groundbreaking technology enables data transmission over longer distances with high bandwidth and lower power consumption compared to traditional copper and electricity wire-based chips. The OCI has the potential to transform AI infrastructure by enhancing the connectivity of large-scale CPU and GPU clusters.

The OCI technology was unveiled by Intel’s Integrated Photonic Solutions (IPS) group at the 2024 Optical Fiber Communications Conference (OFC) in March 2024. The core of this technology is a fully integrated optical input/output chiplet that is seamlessly incorporated into Intel CPUs. Unlike traditional electrical I/O, which has limited scalability due to operating over short distances, the OCI supports 64 lanes of 32 Gbps data transmission in each direction over optical fiber up to 100 meters. This capability meets the requirements of AI infrastructure that necessitates high bandwidth, low power consumption, and long-distance communication.

By replacing current electrical I/O hardware with optical I/O solutions like the OCI chiplets, Intel aims to enhance the performance and reduce power costs associated with AI scaling. The OCI chiplet can handle bidirectional data transfers of up to 4 Tbps and can be integrated not only with CPUs but also with GPUs, AI chip IPUs, and other SoCs. This integration of photonic interconnect solutions into computing systems is expected to boost bandwidth, extend communication range, and decrease power consumption, thereby accelerating machine learning workloads and revolutionizing high-performance AI infrastructure.

Thomas Liljeberg, senior director of products and strategy at Intel’s IPS Group, highlighted the increasing pressure on data center infrastructure as server-to-server data movement rises. He emphasized that current electrical I/O solutions are nearing their limits, making Intel’s OCI breakthrough a significant advancement. The seamless integration of photonic interconnect solutions into next-generation computing systems is set to elevate machine learning workloads and drive advancements in high-performance AI infrastructure.

In conclusion, Intel’s demonstration of the fully integrated OCI chiplet represents a significant milestone in optical computing technology. By leveraging optical input/output chiplets alongside CPUs, Intel is pioneering a new era of AI infrastructure design that prioritizes high bandwidth, low power consumption, and long-distance communication. This breakthrough has the potential to revolutionize the scalability and performance of AI systems, marking a major step forward in the field of computational technology.

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