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Intel introduces LGA1851 socket with “Reduced Load ILM” option to enhance CPU temperatures without custom contact frames

Intel introduces LGA1851 socket with “Reduced Load ILM” option to enhance CPU temperatures without custom contact frames


According to a hardware leak shared by Jaykihn on Twitter, Intel is reportedly introducing a new LGA1851 Socket for the Arrow Lake processors. These processors are said to support two Independent Load Mechanisms (ILMs) – a default one similar to LGA1700 and a secondary model called “Reduced Load ILM” (RL-ILM) aimed at enthusiasts and overclockers seeking better thermal performance.

The LGA1700 socket has been criticized for its poor ILM design, causing issues with 12th, 13th, and 14th generation processors like Alder Lake, Raptor Lake, and Raptor Lake Renovation. This design flaw has led to CPUs bending in the center when being installed, resulting in inadequate contact between the CPU heatsink and increased temperatures.

The new RL-ILM is said to be an optional upgrade for Intel board partners, priced only $1 more than the default ILM. This could motivate many board partners to opt for the higher-performance ILM for mid-range, flagship, and overclocking-specific LGA1851 motherboards. The specific design details of the RL-ILM are not yet known, but it is expected to prioritize cooling performance by distributing contact points across more areas of the CPU, reducing the risk of bending and ensuring better cooling efficiency.

This new RL-ILM upgrade could be beneficial for users of older LGA1700 motherboards and CPUs, who often need aftermarket contact frames to improve thermal performance. Some high-end cooling system manufacturers have even designed custom contact frames that can replace Intel’s ILM, such as the Arctic Freezer III.

In conclusion, the introduction of the RL-ILM for the LGA1851 socket could address previous issues with CPU bending and poor cooling performance, providing a more efficient and effective solution for enthusiasts and overclockers. This upgrade may offer better thermal performance and stability, making it a valuable option for those looking to push their CPUs to their limits.

Article Source
https://www.tomshardware.com/pc-components/motherboards/intels-new-cpu-socket-may-not-need-custom-contact-frames-to-drop-temperatures-anymore-the-lga1851-socket-allegedly-features-reduced-load-ilm-to-improve-thermal-performance

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