Intel’s foundry ecosystem partners have recently introduced reference flows for advanced EMIB (Embedded Multi-die Interconnect Bridge) packaging. This technology allows for the integration of multiple chips on a single package, enabling enhanced performance and power efficiency in electronic devices.
EMIB packaging is a key innovation in the semiconductor industry as it enables different types of chips to be interconnected on a single substrate. This technology has been gaining traction in recent years due to its ability to improve signal integrity, reduce power consumption, and increase overall performance.
The reference flows introduced by Intel’s partners will streamline the design and development process for manufacturers looking to leverage EMIB packaging in their products. By providing a set of guidelines and best practices, these reference flows will help ensure the successful implementation of EMIB technology in a wide range of devices.
Overall, the addition of reference flows for advanced EMIB packaging by Intel’s foundry ecosystem partners represents a significant step forward in the adoption of this innovative technology. As more manufacturers incorporate EMIB packaging into their products, consumers can expect to see improvements in performance and efficiency across a variety of electronic devices.
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https://www.digitimes.com/news/a20240625VL202/intel-foundry-emib-advanced-packaging-ic-manufacturing.html
