At the 2024 Optical Fiber Communications Conference (OFC), Intel showcased a cutting-edge innovation in chip and interconnect design. The company introduced the Optical Computing Interconnect (OCI) Chiplet, which combines a photonics integrated circuit (PIC) with an electrical IC. This chiplet, when integrated with an Intel CPU, demonstrated live data processing capabilities. Intel believes that this technology is a game-changer, as it can address the increasing demand for higher bandwidth over longer distances while consuming less power. Initially, the applications for OCI will focus on AI infrastructure and high-performance computing environments where scalability issues are becoming more apparent in large-scale deployments.
According to Intel’s press release, the transition from electrical I/O to optical I/O on CPUs and GPUs is compared to upgrading from horse-drawn carriages to cars and trucks for delivering goods. This analogy signifies the significant improvement in performance and power efficiency that optical I/O solutions like Intel’s OCI chiplet can bring to the AI scale.
Despite being a prototype, the OCI chiplet already supports bi-directional data transfers of up to 4 terabits per second (Tbps) at distances of up to 100 meters. Additionally, the technology is compliant with PCIe 5.0 specifications, making it easily integrable into existing PCIe-compatible systems. Intel claims that the OCI solution is highly energy-efficient, consuming only 5 picojoules (pJ) per bit compared to approximately 15 pJ/bit for plug-in optical transceiver modules.
The versatility of the OCI chiplet allows for integration with future CPUs, GPUs, and SoCs, potentially revolutionizing the design of PCs in the coming years. For instance, a GPU that does not require a PCIe slot could be installed anywhere in a compatible case and connected to a motherboard via a cable without sacrificing performance. This could result in improved cooling performance and simpler (and more cost-effective) motherboard designs.
Intel has developed a new silicon photonics manufacturing process to facilitate the scalability of the OCI technology from 4 Tbps to potentially tens of Tbps in the future. The use of glass substrates in chips with optical interconnections indicates further advancements in this exciting field.
In conclusion, Intel’s introduction of the OCI chiplet at OFC 2024 represents a significant step towards harnessing the potential of optical interconnect technology for improving data transfer speeds, power efficiency, and overall system performance. With the ability to revolutionize the design and functionality of future computing systems, the OCI chiplet holds promise for driving innovation in various sectors, from AI infrastructure to consumer electronics.
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https://www.pcgamer.com/hardware/vr-hardware/intel-claims-its-optical-interconnect-chiplet-technology-is-like-going-from-using-horse-drawn-carriages-to-using-cars-and-trucks/
