Intel boasts chip package the size of a dinner plate

Intel boasts chip package the size of a dinner plate

Trying to make AI chips big enough to solve Moore’s Law

Troubled Chipzilla used the IEEE Electronic Components and Packaging Technology Conference to brag about new packaging tech that glues together processors into something massive enough…

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https://www.fudzilla.com/news/61170-intel-boasts-chip-package-the-size-of-a-dinner-plate