Intel begins mass production of ‘Intel 3’ processor using 3nm equivalent process technology

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Intel begins mass production of ‘Intel 3’ processor using 3nm equivalent process technology


Intel has announced the beginning of mass production for its ‘Intel 3’ process, with semiconductors manufactured using this process showing an 18% improvement in processing performance per watt compared to the previous generation Intel 4. This development marks a significant step for Intel as it strives to regain process leadership in the semiconductor industry.

Previously, Intel labeled its semiconductor process rules using the ‘Intel XX nm’ convention, such as ‘Intel 14 nm’ and ‘Intel 10 nm’. In 2021, the company introduced a new naming convention, including ‘Intel 7’, ‘Intel 4’, ‘Intel 3’, and ‘Intel 20A’, aligning its terminology with industry standards. The shift in naming conventions aims to better correspond with the process rules of other companies like TSMC. This change positions Intel’s ‘Intel 3’ as the equivalent of ‘3nm’ processes from other manufacturers.

Intel’s partnership with Qualcomm to manufacture new chips and its roadmap until 2025 highlight the company’s commitment to innovation and collaboration within the industry. Intel’s strategic goal of developing five process nodes in four years has already seen the mass production of Intel 7 and Intel 4. The deployment of Intel 3 manufacturing lines in Oregon and Ireland, with trial production completed by the end of 2023, has now transitioned into mass production at both facilities.

The Intel 3 process focuses on producing high-efficiency, high-performance cores for the Xeon 6 server CPU series, offering a substantial 18% improvement in processing performance per watt compared to Intel 4 semiconductors. Additionally, Intel is working on developing variations of the Intel 3 process, including Intel 3T, 3E, and 3PT, each offering unique enhancements and capabilities for silicon pathways and external interfaces.

Furthermore, Intel’s next-generation laptop processor, ‘Lunar Lake,’ will be manufactured at the TSMC factory, demonstrating Intel’s versatility and strategic partnerships within the semiconductor landscape. With an emphasis on AI performance and power efficiency, the ‘Lunar Lake’ processor represents Intel’s ongoing commitment to pushing the boundaries of technology and performance in the laptop market.

Overall, Intel’s advancements in semiconductor manufacturing, particularly with the introduction of the Intel 3 process, showcase the company’s dedication to innovation and competitiveness in the industry. By leveraging partnerships, developing cutting-edge technologies, and adapting to industry standards, Intel continues to position itself as a leading player in the semiconductor market.

Article Source
https://gigazine.net/gsc_news/en/20240620-intel-3nm-foundry/