Intel has started mass-producing chips using its new Intel 3 process, which was announced at the annual VLSI Symposium. This new process is an improvement over the previous Intel node 4 and is being utilized by both Intel and its external customers. The production of Intel 3 chips has commenced at Intel facilities in Oregon and Ireland ahead of the planned schedule for the end of 2023. The latest Xeon 6 CPUs, designed for data centers, are now being produced using the Intel 3 process. This new 3nm node offers up to 18% improved performance and up to 10% higher transistor density compared to its predecessor.
The Intel 3 process introduces two different libraries of transistor groups, giving chipmakers the flexibility to choose between a high-performance library and a higher density library for optimizing chip design. Customers can also select from three different metal stacks based on their requirements. Intel has announced that Intel 3 will be the latest process to use finFETs, with plans to transition to GAA transistors for the next 20A node later this year. GAA transistors completely surround the silicon channels, improving control over electrical flow and reducing issues like leakage currents.
Intel’s move to offer the Intel 3 process to external customers marks a strategic shift for the company as part of its IDM 2.0 strategy to expand its role in the semiconductor industry. More enhancements and variants of Intel 3 are expected in the future, with additional features and improved performance. Intel also plans to introduce an 18A process powered by GAA technology for third-party customers.
Overall, the Intel 3 process signifies a significant technological advancement and strategic direction for Intel as it aims to broaden its reach in the semiconductor market. The use of new technologies like GAA transistors and the flexibility in design options demonstrate Intel’s commitment to innovation and meeting the evolving needs of its customers. With mass production already underway, Intel is poised to solidify its position as a leading chip manufacturer in the industry.
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