Intel Arrow Lake leak suggests increased PCIe lanes and exclusion of DDR4 support

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Chipzilla is preparing to launch its new Arrow Lake-S platform, showcasing the new LGA-1851 socket and 800-series chipsets to motherboard vendors and manufacturers. A leaked slide from one of the events confirms rumors about the upcoming platform, revealing key details about the 800 series motherboards. The leaked image originated from the Chinese technology forum ChipHell and showcases that the new motherboards will offer 32 PCIe lanes, with 16 dedicated to PCIe Gen5 lanes for graphics and 4 for SSD storage. Users will also have the option to add another SSD using a PCIe Gen4 x4 interface connected directly to the CPU, without sacrificing any Gen5 lanes for GPUs and storage.

Additionally, the leaked image indicates that Arrow Lake will no longer support DDR4 memory, only DDR5. This means that users looking to upgrade from DDR4 setups will need to invest in new memory modules. However, the cost of DDR5 has significantly decreased in recent months, making the transition more feasible for gamers and DIY enthusiasts.

In terms of connectivity, Arrow Lake will support USB 3.2 Gen 2×2, USB 3.2 Gen 2×1, and USB 3.2 Gen 1. The slide does not specify the exact number of ports for each connection type, but it does confirm support for Wi-Fi 7, Intel 2.5Gb LAN, and Thunderbolt 4 (not Thunderbolt 5). The new platform is expected to launch in the current quarter, featuring improvements over its predecessors, particularly with the introduction of the new LGA 1851 socket – Intel’s first socket change since 2021.

Overall, the leaked slide provides valuable insights into the upcoming Arrow Lake-S platform, offering a glimpse into the new features and changes that users can expect. From increased PCIe lanes to DDR5 memory support, Arrow Lake-S represents an evolution in Intel’s processor lineup, catering to the needs of modern users in terms of performance and connectivity. With the launch expected in the near future, it will be interesting to see how the new platform is received by both manufacturers and end-users, as they adapt to the latest advancements in technology.

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