Insight: Broadcom delivers 2nm 3.5D AI processor, expanding custom chip push against Nvidia

vm_adminMarch 2, 2026

By Levi Li, DIGITIMES Asia, Taipei
Publication Date: 2026-03-02 06:14:00

Naoki Shinjo, SVP, head of advanced technology development unit, Fujitsu Research. Credit: Fujitsu

Broadcom has begun shipping the industry’s first 2nm custom compute SoC built on its 3.5D eXtreme Dimension System in Package (XDSiP) platform to Japan’s Fujitsu, marking a concrete step from roadmap promise…

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