By Paul Smith-Goodson
Publication Date: 2025-12-05 20:34:00
IBM’s 300mm quantum processor wafer features multiple chips arranged in a grid pattern. The shift to 300mm wafer fabrication has doubled IBM’s development speed and enabled substantial increases in chip complexity.
IBM
At its second annual Quantum Developer Conference held recently in Atlanta, IBM presented updates on its roadmap initiatives for an audience of quantum developers, researchers and community leaders from around the world. New quantum processors, research tools and investigation methods hold promise for helping IBM achieve the breakthrough of quantum advantage — when a quantum solution (aided by some classical elements) is verified to be better than competing solutions that employ only classical computing.
As discussed in my coverage of IBM’s quantum roadmap a few months ago, IBM believes that it is on track to achieve utility-scale fault-tolerant quantum computing by 2029. Whenever that milestone is achieved — by IBM or anyone else — it will be the result of…
