By Dow Jones
Publication Date: 2026-10-14 14:50:00
Kelly Cloonan
IBM is working with Siemens on research aimed at advancing its design that packs more transistors onto a chip.
IBM said Wednesday the collaboration will bring together its semiconductor device innovation with Siemens’ expertise in electronic design automation, process simulation, lithography optimization and advanced manufacturing software.
The research will be focused on IBM’s nanostack architecture, a new transistor design it unveiled earlier this year. The nanostack vertically stacks and staggers transistors to pack more transistors onto a chip, and aims to optimize the performance and power efficiency of each transistor.
The technology requires additional advances for manufacturing and production at scale, IBM said. The collaboration with Siemens includes developing advanced virtual models of nanostack in order to model performance, optimize designs and address fabrication challenges before the chips are built, IBM said.
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