By Amit Chowdhry
Publication Date: 2025-11-20 19:22:00
IBM and the University of Dayton have unveiled a new research and development collaboration focused on next-generation semiconductor technologies, marking a significant expansion of their existing partnership and a major investment in the future of United States chip innovation.
The agreement includes more than $10 million in state-of-the-art semiconductor equipment provided by IBM to support a new nanofabrication facility on the University of Dayton campus. The facility is scheduled to open in early 2027 and is expected to play a central role in semiconductor R&D, hands-on education, and workforce development tied to the AI era.
The collaboration will target several advanced technology areas, including AI hardware, photonics, and advanced packaging. A University of Dayton faculty member and IBM Technical Leader will jointly guide research initiatives, enabling students and researchers to collaborate directly with industry experts on cutting-edge semiconductor…
