Broadcom (NASDAQ: AVGO) has announced an expansion of its optical interconnect solutions portfolio for AI infrastructure at OFC 2025. The company showcased innovative technologies targeting 200T optical interconnect solutions, including:
- XPU-CPO: First 6.4-Tbps optics attach for AI accelerators
- Sian3: 3nm 200G/lane DSP for 800G and 1.6T optical transceivers
- Sian2M: First 200G/lane DSP with integrated VCSEL drivers
- 400G EML technology…
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